TECHNOLOGY

Hyperion interconnect solutions – based on an innovative combination of advanced fabrication, next generation interposer, and substrate materials – allow Hyperion to uniquely offer frontend-like capabilities using backend and substrate fabrication infrastructure. Hyperion Interconnect Fabric™ Technologies make up a co-optimized offering of next generation substrate and interposer technology solutions, customized to meet and exceed our customers’ expectations. Our Interconnect Fabrics™ consist of 2.5D and 3D interposer solutions, IC substrate solutions, integrated power delivery, and thermal solutions.

Our revolutionary interconnect fabrication and patterning technology feature in-situ metallization, Omni-Directional Interconnect with True Point to Point™ configuration. The process is enabled by a unique combination of a material system and patterning approach that significantly reduces lead time, offers unparalleled interconnect density, and allows for large scale fabrication of next generation interposers, substrates, and integrated circuit backend layers. QCP® unleashes a unique capability that solves the industry limitations of allowing a high-density interconnect fabrication in large form factor interposers and substrates.

QCIA® is Hyperion’s chiplet integration architecture, fabricated using Hyperion hybrid wafer and panel level fabrication capabilities. Our QCIA® portfolio features 2.5D interposers, 3D interposers and chip stacking, and the integration of thermal chips as well as power delivery components. All these are seamlessly integrated and co-optimized with Hyperion IC-substrate solutions. QCIA® offers industry leading interconnect density while providing unique and unmatched thermal management, high speed, and high temperature performance advantages.

QCIA®: Optimized performance for energy efficient high-performance computing and defense applications Patent Pending application # 63/378864, 63/320560