FOR IMMEDIATE RELEASE

Month XX, XXX

Hyperion Technologies announces plans to build a high-volume semiconductor substrate manufacturing facility in Peoria, Arizona. • A first-of-its-kind high-volume semiconductor substrate factory in the United States. • Offering substrate design and fabrication foundry service for dual use across a wide range of domestic market segments. • Located within the Arizona leading edge semiconductor manufacturing cluster.

Peoria, Arizona, DATE – Hyperion Technologies is a contract manufacturing and design company incorporated in the state of Delaware and headquartered in Scottsdale Arizona, U.S.A. Hyperion plans to build a state-of-the-art, 600,000 square foot, high-volume manufacturing facility in Peoria, Arizona to support the increasing demand for high-density interconnect fabrics in the United States. Construction is expected to start in 2024 with volume production scheduled for 2027. Through its scale (high-volume manufacturing), technology capability, and operational fungibility, Hyperion’s facility is designed to service both a wide array of civilian/commercial as well as defense applications. This includes production of semiconductor substrates and interconnect fabrics critical to U.S economic security across automotive, medical devices, aerospace, defense, high performance computing, artificial intelligence among several other computing and infrastructure-critical sectors.

The planned facility will be constructed over 4-phases with the initial phase offering leading-edge substrate technology suited to support the 7 nm+ nodes. Later phases will include high mix capacity, next generation substrate technology, and a dedicated line for 3-dimensional interconnect fabrics supporting both silicon and non-silicon-based semiconductor devices. Upon completion, Hyperion estimates the project to generate approximately 6,000 total construction and direct job opportunities in the greater Phoenix area.

Located in the heart of the Nation’s leading-edge Arizona semiconductor manufacturing cluster, Hyperion is uniquely positioned to play a significant role in strengthening the domestic semiconductor ecosystem. Hyperion’s project addresses an acute vulnerability for the U.S domestic semiconductor supply chain, namely the lack of high-volume manufacturing capacity delivering leading-edge semiconductor substrates. The project is a strategic complement to the CHIPS and science act initiative incentivizing the establishment of at least two semiconductor clusters in the United States.

The CHIPS and Science Act was established to boost US competitiveness, innovation, and national security in the semiconductor industry. As part of the $52.7 billion program, the federal government will award $39 billion to US companies in competitive grants to manufacturers to finance construction, expansion, and modernization of facilities and equipment.

To ensure success for a project of this capital magnitude and strategic value in the United States, Hyperion has applied for the CHIPS Act funding. These funds will be critical to Hyperion’s project scale, scope, and timing.

The project announcement reflects a strong collaboration and mutual support among several public and private partners of Hyperion Technologies including the City of Peoria, the Arizona Commerce Authority, several other Arizona government authorities, Austin industries, Concept development and a long list of domestic and global ecosystem and supplier partners. Hyperion’s manufacturing facility will uniquely position Arizona’s semiconductor ecosystem toward the envisioned goal of a complete semiconductor supply chain cluster incentivized by the CHIPS act. This project is a crucial step and an urgent effort to address an acute vulnerability in the U.S semiconductor supply chain. It opens the door to a robust, secure, and self-sufficient semiconductor industry in the United States. Hyperion and its extended ecosystem partners’ shared vision is to strengthen America’s technological infrastructure, stimulate economic growth, uphold national security, and foster innovation.

U.S manufacturing output of leading-edge, high-density interconnect substrates is currently at zero percent of global output- i.e., there is no high-volume substrate manufacturing facility located in the United States capable of producing leading-edge substrates like what is currently being produced overseas. Establishing a domestic, high-volume substrate manufacturing operation that has the volume scale, operational fungibility, and technological capabilities at the leading edge is of paramount criticality to the resilience and viability of the U.S semiconductor industry. It is also fundamental to advancing the U.S economic and national security as the chief objective of the CHIPS incentives program. Semiconductor technology is at an inflection point—as Moore’s law progresses and traditional scaling slows down. To continually enhance processor performance at yield, the integration of small chips (chiplets) and heterogenous integration through packaging substrate has become a prevailing trend in semiconductors. The time is now to invest in a fully domestic, U.S.-based substrate manufacturing operation that not only address the present need and acute vulnerability of the supply chain, but also offers a rare opportunity for the U.S to leapfrog into technological leadership. Hyperion’s project is exactly that- an operation with sufficient scale utilizing the most advanced commercial technology to produce substrates most critical to U.S competitiveness.

About Hyperion Technologies Hyperion Technologies is a contract manufacturing and design company incorporated in the state of Delaware and headquartered in Scottsdale Arizona, U.S.A. Hyperion’s Foundational offerings include full design and fabrication of integrated circuit substrate, full design, and fabrication of chiplet interconnect fabrics (2.5 and 3D) and post fabrication, turnkey supply chain service. Hyperion operates its businesses as an independent-merchant foundry serving the domestic semiconductor market.

For further information, please contact: info@hyperiontech.us

This press release contains forward-looking statements within the meaning of the federal securities laws, including statements about the amount and timing of CHIPS funding and government support, the start of production in Arizona, the size, capability, output and other features and benefits of the facility, the amount of investment, the supply chain, job creation, our market position, and growth. You are cautioned not to place undue reliance on forward-looking statements. All forward-looking statements in this press release are made based on our current expectations, forecasts, estimates, and assumptions. Because such statements include risks and uncertainties, actual results may differ materially from those anticipated in such forward-looking statements. Risk factors that could affect the outcome of the events set forth in these statements include, but are not limited to, that there can be no assurance that the facility will be built on the timeline, at the cost or to the specifications expected or at all or that the facility will generate sales or other benefits of the type or amount expected or at all and other factors discussed in the company’s reports filed with or furnished to the Securities and Exchange Commission. All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by this cautionary statement. We assume no obligation to review or update any forward-looking statements to reflect events or circumstances occurring after the date of this press release except as may be required by applicable law.