PRODUCTS

Hyperion offers build Up HDI substrate based on both organic and inorganic Core technologies. Hyperion Substrates fabrication capabilities delivers a wide array of form factors, layer counts and substrate interconnect configurations. Hyperion substrates offer embedding and full integration capabilities with various passive, active and interconnect circuit elements necessary for advanced high-performance applications.

Hyperion proprietary Hybrid Manufacturing process flow yields a unique double sided substrate architecture with system level integration capabilities for Chiplets on both sides. The unique architecture offers industry leading density and superior thermal management leading to differentiated power efficiency and interconnect density performance.

Hyperion interconnect fabrication technologies allows us to seamlessly integrate a variety of semiconductor components and chips ubiquitously into a single 3D package of multiple stacks. Using Hyperion fully automated fabrication facility in conjunction with our novel materials and metallization technology, we are offering fab-like design rule capabilities using substrate and Ban-end of line infrastructure. A unique advantage for Hyperion technologies offering differentiated cost, performance and time to market for our customers. Our Chiplets interconnect fabrics products includes; 2.5D substrates, 25D interposers, 3D interposers and fully integrated systems of multi-die stacks.

We offer fully integrated power delivery solutions and full power network optimization with our modules. Hyperion power delivery solutions are offered both as a stand alone modules or through a fully integrated packaging solution.